Central Taiwan Science Park Approves Two New Companies with NT$65 Million Investment
Translated from Chinese, summarized and contextualized by DistantNews.
At a glance
- The Central Taiwan Science Park has approved two new companies to set up operations, with a combined investment of NT$65 million.
- These additions bring the total number of new investment cases in the park this year to 10, totaling NT$5.298 billion.
- One company, Xin Tai Industrial Co., will focus on semiconductor equipment, while Feng Rong Intelligent Machinery will specialize in smart packaging and automation solutions.
The Central Taiwan Science Park (CTSP) has approved two new investment projects totaling NT$65 million, further bolstering its semiconductor industry ecosystem. This brings the total number of new investment cases in the park this year to 10, with a cumulative investment value of NT$5.298 billion. The approved companies are Xin Tai Industrial Co. and Feng Rong Intelligent Machinery, both slated to establish facilities within the park's Taichung campus. Xin Tai Industrial will invest NT$15 million, focusing on semiconductor equipment, including hardware, process optimization, refurbishment of used equipment, and high-purity silicon consumables for next-generation atomic layer deposition processes. The company specializes in advanced equipment and critical components for semiconductor front-end processes, offering comprehensive technical services from basic parts repair to in-depth refurbishment of used equipment with a one-year warranty. Feng Rong Intelligent Machinery will invest NT$50 million, concentrating on smart packaging for semiconductor wafers and inspection equipment for wafer carriers, alongside logistics and warehousing automation solutions, and automation equipment for semiconductor packaging and testing processes. Feng Rong Intelligent Machinery is dedicated to the research and development of smart automation equipment and system integration, having developed a wafer finished product packaging system that integrates high-precision handling and AI visual inspection. Their proprietary FOUP/FOSB carrier gripping design effectively reduces wafer damage risk and enhances shipping efficiency. The CTSP aims to integrate international intelligence with domestic industry-academia research capabilities through these investments, constructing an independent technology chain with sustainable carbon reduction benefits and strengthening the localization resilience of Taiwan's high-end semiconductor supply chain.
Originally published by Liberty Times in Chinese. Translated, summarized, and contextualized by our editorial team with added local perspective. Read our editorial standards.