Hanyang University team wins triple crown at top semiconductor packaging conference

A research team from Hanyang University's Department of Mechanical Engineering, led by Professor Kim Hak-sung, has achieved a significant milestone by securing three top honors at the Electronic Components and Technology Conference (ECTC) 2026, widely regarded as the premier global event for semiconductor packaging. This accomplishment, realized through close industry-academia collaboration with leading Korean firms including Hanwha Semitech, Samsung Electronics, and Nopion, underscores South Korea's prowess in advanced semiconductor packaging technology.

The ECTC 2026, organized by the IEEE EPS (Electronics Packaging Society), is a highly competitive arena where global tech giants and research institutions showcase their latest innovations. The Hanyang University team's research, presented from May 26-30 in Orlando, Florida, earned them two "Student Travel Grants" – one for an oral presentation and one for a poster presentation – along with the selection of a "Highlight" paper, totaling three key recognitions.

One of the most notable achievements was the "Student Travel Grant" awarded for research on a next-generation interconnect process developed in partnership with Hanwha Semitech. The study, titled "Simplified Fluxless Bonding via Ultraviolet Activation: Enabling High-Reliability Fine-Pitch Interconnects," presented by Kim Yu-kwon, a combined Master's and Ph.D. student, demonstrated a groundbreaking technique that eliminates the need for flux using UV activation. This innovation significantly simplifies the process while enabling highly reliable fine-pitch interconnects, a testament to the synergy between Hanwha Semitech's industry needs and Hanyang University's core technology.

Further accolades came from collaborative research with Samsung Electronics and Nopion. Yu Dong-hoon, another combined Master's and Ph.D. student, received a "Student Travel Grant" for his research on predicting the reliability of SAC solder under drop impact, incorporating high strain rate and temperature-dependent properties. The team's work with Nopion on "Game-Changing Nanosolder Technology" was recognized as a "Highlight" paper among the approximately 450 technical submissions, acknowledging its potential to revolutionize interconnects below 10µm. Professor Kim expressed pride in the collective effort, emphasizing its role in advancing Korea's semiconductor packaging competitiveness and nurturing global talent.

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The achievements at ECTC 2026 are valuable results created through the organic unity of domestic large, small and medium-sized enterprises, universities, and government support projects, all working towards a common goal.