LG Innotek to Unveil First FC-BGA for AI Accelerators, Begin Glass Substrate Production in 2028

LG Innotek is preparing to unveil its first flip-chip ball-grid-array, or FC-BGA, substrate designed for artificial intelligence accelerators.

The company plans to showcase the product at KPCA Show 2026, an international exhibition focused on semiconductor substrates and advanced packaging. The event will take place from the 9th to the 11th at Songdo Convensia in Incheon.

LG Innotek said it will begin mass production next year of high-value FC-BGAs for AI training and inference. In 2028, it plans to move into full-scale production of glass substrates, which are regarded as a next-generation semiconductor substrate.