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Seoul City University team wins top prize at Simulation Challenge 2026

From Hankyoreh · () Korean

Translated from Korean, summarized and contextualized by DistantNews.

At a glance

News Named sources Outcome reported
  • A student team from Seoul City University's Advanced Semiconductor Packaging Lab won the grand prize at the 'Simulation Challenge 2026'.
  • The team, 'Let's Save the World with Hybrid Bonding,' presented a novel design for a bonding tool to reduce voids in hybrid bonding processes.
  • The competition saw increased participation this year, with universities nationwide competing in separate undergraduate and graduate divisions.

A student team from Seoul City University's Advanced Semiconductor Packaging Lab has clinched the top prize at the 'Simulation Challenge 2026.' The team, named 'Let's Save the World with Hybrid Bonding,' earned the grand prize in the undergraduate division for their innovative solution to a critical issue in semiconductor packaging.

The competition, co-hosted by Synopsys Korea and Taesung SN, challenges participants to use simulation software to solve real-world technical problems. This year's event saw a significant increase in participation, with 149 teams initially applying and 80 teams advancing to the preliminary rounds. Notably, the undergraduate and graduate divisions were separated for the first time, with 14 teams reaching the finals.

Students have meaningfully solved the hybrid bonding void issue by linking equipment structure and simulation, and developing it into a creative design.

— Park Ah-youngThe supervising professor's comments on the team's achievement.

The winning Seoul City University team, comprised of students Choi Seung-wook, Jang Sun-woong, and Kim Kwon-hee, focused their research on reducing voids in the hybrid bonding process. Hybrid bonding is a key technology for high-density semiconductor packaging, such as HBM and chiplets. Their proposed design for a radial collet bonding tool aims to control the curvature and contact behavior during bonding, thereby minimizing the trapping of air and reducing void formation.

Professor Park Ah-young, who supervised the team, praised their ability to connect equipment structure with simulation to solve the void problem and develop a creative design. Team representative Choi Seung-wook expressed gratitude for Professor Park's guidance, acknowledging the collaborative effort that led to their success. The university stated that this achievement highlights their research and educational capabilities in advanced semiconductor packaging, and they plan to continue developing technologies and nurturing talent for the industry.

This award was possible thanks to the team members who worked together and the professor's meticulous guidance.

— Choi Seung-wookThe team representative's remarks after receiving the award.
DistantNews Editorial

Originally published by Hankyoreh in Korean. Translated, summarized, and contextualized by our editorial team with added local perspective. Read our editorial standards.

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