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Taiwan Targets Semiconductor Output Above NT$8 Trillion in 2026, Supports 84 Chip and Equipment Firms

From Liberty Times · () Chinese

Translated from Chinese and summarized by DistantNews. Read the original for the full story.

At a glance

News Official statement New plan
  • Taiwan’s Industrial Development Administration opened a pavilion at SEMICON Taiwan, highlighting advanced packaging equipment, supply chains, machine-tool upgrades and diverse chip applications.
  • Director-General Chiu Chiu-hui said artificial intelligence and high-performance computing demand could push Taiwan’s semiconductor output above NT$8 trillion in 2026.
  • The agency has supported 55 chip-design projects and helped 29 equipment companies develop and validate products, with domestic semiconductor equipment output expected to exceed NT$270 billion in 2026.

Taiwan is aiming to push semiconductor industry output above NT$8 trillion in 2026 as demand for artificial intelligence and high-performance computing continues to grow. The target was outlined by Chiu Chiu-hui, director-general of the Industrial Development Administration, at the opening of the agency’s pavilion at SEMICON Taiwan.

The pavilion brings together 17 leading Taiwanese equipment and chip-design companies. Its central themes are advanced packaging equipment, foreign supply chains, machine-tool transformation and upgrades, and diverse chip applications. Together, they present Taiwan’s semiconductor ecosystem as extending from key manufacturing equipment to new applications for innovative chips.

The administration said it has supported 84 chip-design and semiconductor-equipment companies. On the chip-design side, its advanced development subsidy program has approved 55 projects focused on emerging applications including artificial intelligence, robotics, drones and satellite communications.

For equipment makers, the agency’s whole-machine verification program connects companies with demand from major manufacturers including TSMC and ASE. It has helped 29 companies complete equipment development and production-line validation. The agency said companies such as GMM Precision, Scientech, MPI, Gudeng and All Ring are now important partners in Taiwan’s advanced packaging development, helping drive domestic semiconductor-equipment output above NT$270 billion in 2026.

The agency also highlighted GMM Precision’s development of what it called the industry’s first panel-level advanced-packaging die-bonding machine. The system can handle chips of different sizes and orientations in one piece of equipment and uses intelligent image alignment to complete die bonding in a single operation. The company says the approach cuts processing time by 50 percent. The administration plans to continue supporting development of CoWoS, CoPoS and next-generation advanced-packaging technologies and components.

Taiwan’s semiconductor industry is striving to exceed NT$8 trillion in output in 2026.

— Chiu Chiu-huiThe Industrial Development Administration director-general described the industry’s output target at SEMICON Taiwan.
About this summary

Originally published by Liberty Times in Chinese. Translated, summarized, and contextualized automatically by DistantNews, with a note on how the source frames the story. Not individually reviewed before publishing. How this works.

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