Topco, Robocore, TDK Partner on Next-Gen Power Modules for AI Robots

Taiwanese companies Topco Materials, Robocore, and TDK have joined forces to advance the development of "Next-Gen Power Modules" crucial for AI robots and unmanned vehicles. The collaboration leverages the core strengths of each company to build a vital power supply chain for the rapidly evolving AI robotics sector.

Topco Materials will contribute advanced packaging and thermal management solutions to enhance heat dissipation and reliability for chips and power modules. Robocore will provide its high-efficiency, high-power density Power SoC chip platform, serving as the control core for intelligent machines and autonomous vehicles. TDK will integrate its expertise in high-efficiency motors and power modules to create a new generation of power platforms, optimizing chip control, thermal design, and motor systems.

“

AI robots' rapid development relies not only on continuous improvements in computing power but also on thermal management of chips and power modules, which has become a key factor affecting overall system performance.

Tsai Chao-yang, Chairman of Topco Materials, highlighted the critical role of thermal management in AI robot performance. He stated that Topco Materials has been actively developing high-thermal-conductivity, low-thermal-resistance materials to improve the performance of AI chips and electronic systems. This innovation supports diverse applications, including advanced packaging, smart terminal devices, and AI robots.

The initiative addresses the increasing demand for power systems that are compact, efficient, and reliable for extended operation, driven by the rapid growth of AI robotics and smart manufacturing. The partnership signifies a strategic move to consolidate industry capabilities and strengthen Taiwan's position in the global AI hardware supply chain.

“

In recent years, Topco Materials has actively invested in electronic materials and advanced packaging fields, continuously developing heat dissipation materials with high thermal conductivity, low thermal resistance, and high reliability.