TSMC boosts US investment by $100 billion, State Department welcomes move

Taiwan Semiconductor Manufacturing Co. (TSMC) is significantly expanding its footprint in the United States, announcing an additional $100 billion investment to construct four wafer fabrication plants and an advanced packaging facility in Arizona. This move aims to meet the robust demand from U.S. customers for years to come.

The U.S. State Department has lauded the investment, viewing it as a testament to the enduring and growing trade and investment ties between the U.S. and Taiwan. A spokesperson emphasized that the investment not only creates American jobs but also bolsters the nation's leadership in critical national security technology sectors.

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This announcement demonstrates the long-term, deep, and continuously growing trade and investment relationship between the United States and Taiwan.

This latest commitment escalates TSMC's total investment in the U.S. to $265 billion, following a trade and investment agreement reached earlier in the year. The project is expected to generate substantial construction and high-tech employment opportunities in Arizona, alongside billions in indirect economic output.

While TSMC deepens its U.S. operations, the company also reaffirms its commitment to Taiwan, with plans to build 13 advanced wafer fabs there in the coming years. This dual strategy ensures continued growth and technological advancement in both regions.

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This announcement demonstrates the long-term, deep, and continuously growing trade and investment relationship between the United States and Taiwan.