Winstek's AI-driven demand fuels record revenues in June and Q2

Winstek, a Taiwanese manufacturer of semiconductor testing interfaces, has announced a surge in revenue, setting new records for June, the second quarter, and the first half of 2026. The company's performance is largely attributed to robust demand from clients in the Artificial Intelligence (AI) and High-Performance Computing (HPC) sectors.

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AI customers are strongly pulling in goods, driving capacity to full load. With the capacity of the Kaohsiung Renwu new plant increasing, it is expected to accelerate order fulfillment and inject growth momentum into performance.

In June, Winstek achieved a consolidated revenue of NT$1.46 billion, marking a significant month-on-month increase of 36.03% and a year-on-year jump of 287.9%. The second quarter saw consolidated revenue reach NT$3.523 billion, up 18.22% from the previous quarter and 130% from the same period last year. For the first half of the year, cumulative revenue stood at NT$6.504 billion, a 70.27% increase compared to the previous year.

Despite minor disruptions from a typhoon holiday impacting shipments, Winstek's revenue continued to climb in June. The company highlighted that demand for applications such as AI, HPC, ASIC, GPU, CPU, and AP remains strong. Looking ahead to the third quarter, Winstek expects continued growth, with AI customers driving high demand and its new Renwu factory in Kaohsiung expected to accelerate order fulfillment.

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Advanced packaging such as CoWoS, CoPoS, and CPO have become market mainstream, driving high-end testing demands for high frequency, high power, high pin counts, and large packages.

Winstek also noted the growing market trend towards advanced packaging technologies like CoWoS, CoPoS, and CPO, which are increasing the demand for high-end testing solutions. These include interfaces for high frequency, high power, high pin counts, and large packages. The company's next-generation AI test interface platform, particularly its dual-layer HyperSocket-DH, is gaining market traction, with several AI clients adopting it. Additionally, its functional burn-in testing has attracted new customers.

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The dual-layer HyperSocket-DH has been adopted by multiple AI customers, and functional burn-in testing has also gained favor with new clients.