3D-Micron to Invest Up to NT$1.7 Billion for Giantplus Stake

3D-Micron Technology (3491) announced a significant strategic move to bolster its presence in the low-orbit satellite and millimeter-wave communication sectors. The company's board of directors approved an investment of up to NT$1.7 billion to acquire a controlling stake in Giantplus Technology.

Following the transaction, 3D-Micron, combined with its existing shareholding, will hold over 51% of Giantplus's equity. This acquisition is designed to enhance 3D-Micron's product offerings, technological expertise, and customer base within these high-growth markets. The company views this as a crucial step in its mid-to-long-term development strategy, aiming to increase operational resilience and drive future growth.

Giantplus Technology specializes in the development and manufacturing of high-frequency and high-speed interconnect products. Its product range includes RF/microwave/millimeter-wave connector solutions and high-speed signal modules. These components are widely used in demanding applications across data centers, aerospace and satellite communications, mobile communications, and semiconductor industries.

The acquisition is subject to the fulfillment of contractual conditions and closing procedures, with the transaction anticipated to be finalized by August. Once completed, Giantplus will officially become a subsidiary of 3D-Micron, integrating its capabilities into the parent company's broader operations.