Chiayi Science Park Phase 2 Breaks Ground, Led by TSMC to Build Global Advanced Packaging Hub

The second phase of the Chiayi Science Park has officially commenced with a groundbreaking ceremony, marking the start of a significant development project. The new base, spanning approximately 90 hectares, is slated for completion in three years and is poised to become a major center for technological innovation.

Taiwan Semiconductor Manufacturing Company (TSMC) will spearhead the development, focusing on establishing a core industrial cluster centered around advanced packaging technology. This strategic focus aims to position the Chiayi Science Park as a global leader in this critical area of semiconductor manufacturing.

The groundbreaking ceremony itself was conducted in conjunction with a ritual, symbolizing the formal initiation of the project. The development is expected to attract significant investment and foster a collaborative ecosystem for companies involved in advanced semiconductor packaging.