Compal's subsidiary targets advanced semiconductor and silicon photonics processes

Compal Group's subsidiary, STC (Sheng Teng Technology), is making strategic moves into the advanced semiconductor and silicon photonics markets, bolstering its "AI Solutions and Smart Manufacturing" portfolio.

The company is set to exhibit three key solutions at SEMICON Taiwan 2026, addressing critical aspects of modern chip manufacturing: Fractilia's CD-SEM measurement technology, ProSys's ultrasonic wafer cleaning systems, and SEMI-TS's in-plant logistics solutions. These offerings are designed to enhance process stability, boost production yields, and optimize overall operational efficiency for semiconductor manufacturers.

STC's General Manager, Chen Kuo-jung, highlighted the growing importance of reliable measurement equipment, high-quality wafer cleaning, and efficient in-plant logistics as semiconductor and silicon photonics processes advance rapidly. By integrating these three solutions, STC aims to move beyond single-point equipment optimization to offer cross-process management, thereby reducing production risks and improving overall performance for its clients.

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As advanced semiconductor and silicon photonics processes develop rapidly, the reliability of measurement equipment, wafer cleaning quality, and in-plant logistics efficiency have become key factors affecting yield and production stability.

In metrology, STC will feature Fractilia's CD-SEM solutions, including FAME EDGE for continuous monitoring and ensuring measurement consistency across different equipment generations. Their computational metrology technology is also being applied to silicon photonics processes to manage structural variations like line-edge roughness, which is crucial for reducing optical scattering and transmission loss. Fractilia reports that over 30 global semiconductor and silicon photonics firms are already using these solutions.

For wafer cleaning, the ProSys ultrasonic cleaning solution, particularly its BevelSonic technology, uses focused acoustic energy for non-contact removal of particles and contaminants from wafer edges and backsides, minimizing cross-contamination and edge damage. Their single-wafer ultrasonic cleaning system, MegPie, has demonstrated a particle removal efficiency (PRE) of 98% in post-chemical mechanical polishing tests.

In plant logistics, SEMI-TS offers a hybrid automated material handling system (AMHS) that integrates overhead transport (OHT) and clean conveyor systems. This approach, already implemented in China and South Korea, can reduce queuing delays by nearly 50%. SEMI-TS's Plug & Play nitrogen purge modules also aim to minimize modification and downtime risks.

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Through the integration of three major solutions, we will extend services from single-point equipment optimization to cross-process management, helping clients reduce production risks and improve overall efficiency.