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Hanmi Semiconductor Unveils 2.5D Packaging Equipment That Combines GPU, CPU and HBM
🇰🇷 South Korea /Technology

Hanmi Semiconductor Unveils 2.5D Packaging Equipment That Combines GPU, CPU and HBM

From Dong-A Ilbo · () Korean

Translated from Korean and summarized by DistantNews. Read the original for the full story.

At a glance

News Official statement New plan
  • Hanmi Semiconductor plans to expand its business into 2.5D packaging equipment for AI system semiconductors.
  • At Semicon Taiwan 2026 in Taipei, it will display advanced equipment including 2.5D thermal-compression bonders for AI chips and HBM.
  • Four of the five displayed models have entered phased production deliveries to global foundries and OSAT companies, while the 2.5D TC Bonder 120 is nearing launch.

Hanmi Semiconductor is moving further into AI chip packaging with equipment designed to bring GPUs, CPUs and high-bandwidth memory together in a 2.5D package.

The South Korean company will participate in Semicon Taiwan 2026, a semiconductor equipment and materials exhibition in Taipei. The event runs from the second through the fourth, where Hanmi will present thermal-compression bonders for AI system semiconductors and HBM.

Its display will include five 2.5D packaging machines: the FC Bonder 3.5, FC Bonder 75, 2.5D TC Bonder 40 C2S, 2.5D TC Bonder 40 C2W and 2.5D TC Bonder 120.

The FC Bonder 3.5, FC Bonder 75 and both 40-series 2.5D TC bonders entered phased launches from late last year and are being supplied for mass production to global foundries and outsourced semiconductor assembly and test companies. The 2.5D TC Bonder 120 is preparing for release. 2.5D packaging uses a silicon interposer.

About this summary

Originally published by Dong-A Ilbo in Korean. Translated, summarized, and contextualized automatically by DistantNews, with a note on how the source frames the story. Not individually reviewed before publishing. How this works.

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