Jingmei Technology Showcases Three Product Lines as Second-Half Operations Set to Improve Quarter by Quarter

Jingmei Technology is putting three core product lines on display at SEMICON Taiwan, betting that the rising complexity of AI and high-performance computing chips will keep lifting demand for precision testing components.

The Taiwanese supplier is showcasing micro-drilled upper and lower guide plates, probe-card structural components and ATE Stiffener test frames. Company spokesperson Cheng Ya-wen said all three lines grew this year and that operations should strengthen quarter by quarter in the second half.

Jingmei's revenue increased sequentially during the first half. The company expects existing customer projects to enter mass production while demand for AI chip testing continues. Its three probe-card product lines represented 85% of first-half revenue, and structural components made up the largest portion, at 48%.

Cheng said higher signal-contact density in AI and HPC chips is increasing the number of pins and the density of holes on each probe card. That is driving demand for fine guide-plate drilling, precision structural machining and integrated ATE Stiffener test frames.

The company said major international probe-card makers generally prioritize investment in probe bodies, circuit boards and multilayer substrates, while outsourcing high-precision structural parts and fine machining to specialist suppliers. Jingmei said its customers include the world's largest foundry, probe-card manufacturers in Europe, the United States, Japan and South Korea, and Taiwan's three largest probe-card companies. Chief technology officer Ho Chen-hung said the higher the pin count and hole density, the greater the processing value of each card.