Manz Asia Completes Panel-Level Packaging Equipment Layout Across Multiple Sizes

Manz Asia, a key player in semiconductor panel-level packaging equipment, announced on August 18 that it has finalized its production platform layout for three critical sizes of panel-level packaging electrochemical deposition (ECD) and wet process equipment: 310mm, 510mm, and 700mm.

General Manager Lin Jun-sheng stated that the company has already shipped over 50 ECD equipment units, with the largest, 700x700mm panels, making up more than half of these dispatches. The 510mm size follows, while the 310mm size is experiencing a rapid increase in demand. Manz Asia's core competency lies in RDL (redistribution layer) processes, with ECD at its heart, integrated with cleaning, developing, etching, and stripping wet processes. The company offers the Omni 310, Omni 510, and Omni 700 series equipment.

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panel-level packaging's advantage is 'turning circles into squares,' which can reduce wafer edge area waste.

Lin explained that panel-level packaging offers the advantage of "turning circles into squares," minimizing waste from wafer edges. The 700x700mm size is already in mass production for mature Fan-Out applications. Meanwhile, the 310mm size is being evaluated by clients for transitioning to panel-level 2.5D packaging. For next-generation advanced packaging applications like CoPoS, FOPLP, and glass core substrates, Manz Asia is primarily involved in RDL-related cleaning, etching, wet processes, and ECD plating equipment.

Regarding glass core substrates, Lin noted that the market is still in the research and pilot phase. Manz Asia has enhanced its etching and ECD equipment capabilities to extend to the TGV process for glass core substrates, anticipating that these will primarily adopt the 510mm panel-level advanced packaging specifications. The company is also actively pursuing localization of semiconductor equipment, with Taiwanese market revenue exceeding 50% of its total. Manz Asia, which became a Taiwanese-owned enterprise again last year, plans to list on the emerging stock market in June 2027 and aims for a main board listing by 2028.

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Currently, panel-level packaging ECD equipment shipments have exceeded 50 units, with 700x700mm accounting for more than half.