Samsung Electronics to invest 400 billion won in advanced packaging lab in Yokohama

Samsung Electronics is setting up an advanced semiconductor packaging research and development base in Yokohama, Japan, as it expands cooperation with local materials, parts and equipment companies.

The company plans to invest 40 billion yen, equivalent to about 350 billion won, over five years from 2024. It also intends to increase the number of research personnel at the center to more than 100 by 2027.

Samsung Electronics opened the facility in Yokohama’s Minato Mirai district under the name Advanced Package Lab, according to industry sources cited by the report.