SK Hynix to build advanced AI memory chip plant in Indiana

SK Hynix has broken ground on a new advanced packaging facility for AI memory chips in West Lafayette, Indiana, marking a significant expansion into the U.S. market. The facility, a substantial investment of over $4 billion, will be SK Hynix's first High Bandwidth Memory (HBM) production base in the United States.

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Today is the day that the United States and SK Hynix begin a new future for AI together.

The Indiana plant, situated on a 540,000 square meter site, is slated for completion of its cleanroom in October 2028. Mass production of next-generation HBM chips is scheduled to commence in the second half of 2029. At full operation, the facility is expected to employ around 1,000 people.

The operational model involves importing wafers produced in South Korea for advanced packaging and testing in Indiana, ultimately supplying 'Made in USA' HBM products to U.S. customers. SK Hynix also plans to establish an advanced packaging R&D testbed at the site, fostering collaboration with customers, universities, and business partners on next-generation packaging technologies.

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Indiana Fab will be the base that provides 'Made in USA' HBM for the first time.

This strategic move is anticipated to create over 7,000 direct and indirect jobs in the region. The company also signed a memorandum of understanding with Purdue University for joint research and development in advanced packaging, including HBM technology. SK Hynix aims to expand cooperation with other universities and research institutions in the Midwestern U.S.

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SK Hynix's investment in Indiana is not just an investment in a semiconductor production facility, but the construction of the first AI memory production facility and R&D center in the United States, a unique model for nurturing semiconductor talent and strengthening cooperation with government and external organizations.