TSMC Begins Trial Production of New CoWoS Advanced Packaging Technology

Taiwan Semiconductor Manufacturing Company (TSMC) has initiated trial production for its next-generation CoWoS (Chip-on-Wafer-on-Substrate) advanced packaging technology. This crucial development is slated for mass production in the second half of 2028, according to supply chain analyst Ming-Chi Kuo.

Kuo highlighted that CoWoS aims to improve the economics of ultra-large chip packages exceeding 9.5 mask layers. NVIDIA's upcoming "Feynman" AI chip is anticipated to be among the first products to utilize this advanced packaging. The technology incorporates glass in two primary applications: a temporary 310x310 mm glass carrier and production glass wafers of 250x250 mm for trials and 510x515 mm for mass production. These glass components are later processed and cut into individual glass substrate cores.

The CoWoS architecture features a three-layer stacked structure, known as ABF-GCP (Glass Core Package), with glass positioned in the middle, flanked by ABF (Ajinomoto Build-up Film) material layers. Significant processing challenges lie in the fabrication of these glass components, particularly in forming Through-Glass Vias (TGV) and in the copper filling and metallization steps.

Kuo also clarified common market misunderstandings about CoWoS. He emphasized that the technology does not use a glass interposer; interconnectivity is managed by chip-side RDL (Redistribution Layer) layers, TGV/copper interconnects, and ABF build-up layers. Furthermore, glass does not replace ABF but exists alongside it, and chips are not directly attached to the glass but rather to the surface of the ABF build-up layer.

Successful mass production of CoWoS is expected to solidify TSMC's leading position in the advanced packaging sector, potentially extending its technological advantage through approximately 2032. This advancement is critical for supporting the increasing complexity and performance demands of next-generation AI and high-performance computing chips.