Hanmi Semiconductor showcases advanced AI-chip packaging equipment at SEMICON Taiwan
Translated from Korean and summarized by DistantNews. Read the original for the full story.
At a glance
Press release
Official statement
New plan
- Hanmi Semiconductor is exhibiting 2.5D thermal-compression bonders for AI system semiconductors and HBM packaging at SEMICON Taiwan.
- The Taipei exhibition runs through Sept. 4, 2026.
- Hanmi has served as an official sponsor of SEMICON Taiwan for 12 consecutive years.
Hanmi Semiconductor is using SEMICON Taiwan in Taipei to put its advanced packaging equipment on display, including 2.5D thermal-compression bonders for AI system semiconductors and bonders designed for high-bandwidth memory.
The exhibition runs through Sept. 4, and Hanmi said it is presenting the equipment as part of its participation in the event. The company has joined SEMICON Taiwan as an official sponsor for 12 consecutive years, from 2015 through this year.
About this summary
Originally published by Chosun Ilbo in Korean. Translated, summarized, and contextualized automatically by DistantNews, with a note on how the source frames the story. Not individually reviewed before publishing. How this works.
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