Chipbond Stock Surges to Daily Limit on Advanced Packaging Hopes
Translated from Chinese, summarized and contextualized by DistantNews.
At a glance
- Chip packager Chipbond Technology's stock price surged to its daily limit on August 26, driven by advanced packaging technology.
- The company is shifting from traditional display driver ICs to non-driver IC applications like silicon photonics and LPO.
- Analysts expect the company's second-half performance to surpass the first half, following a comprehensive price increase for packaging services.
Chipbond Technology (6147) saw its stock price hit the daily limit of 185.5 New Taiwan dollars on August 26, fueled by excitement over advanced packaging technologies. The stock broke through its recent trading range, with trading volume reaching 28,000 lots by 10:33 AM and a significant backlog of buy orders.
Institutional investors showed strong buying interest, with foreign investors making their second consecutive purchase of 4,070 shares and proprietary traders adding 320 shares. Investment trusts, however, sold 141 shares, ending a four-day buying streak. In total, institutional investors bought 4,249 shares.
Chipbond is strategically pivoting from traditional display driver ICs to emerging applications such as silicon photonics, LPO, RF, and RFID. This diversification, coupled with a comprehensive increase in packaging and testing service prices in the second quarter, has led analysts to forecast a stronger second half of the year compared to the first.
Originally published by Liberty Times in Chinese. Translated, summarized, and contextualized by our editorial team with added local perspective. Read our editorial standards.