Hanmi Semiconductor to Exhibit New 2.5D TC Bonder at Semicon Southeast Asia

Hanmi Semiconductor is set to make a significant impact at the upcoming 2026 Semicon Southeast Asia exhibition, a premier event for the semiconductor industry in the region. The company's participation underscores its commitment to showcasing cutting-edge technology and expanding its presence in the dynamic Southeast Asian market.

At the heart of Hanmi's display will be its innovative '2.5D TC Bonder' equipment, slated for release later this year. This advanced machinery represents a leap forward in semiconductor manufacturing processes, particularly in the realm of advanced packaging. The exhibition provides a crucial platform for Hanmi to introduce these new capabilities to a global audience of industry leaders, researchers, and potential clients.

Organized by the International Semiconductor Equipment and Materials Institute (SEMI), the 2026 Semicon Southeast Asia exhibition is a key gathering point for the global semiconductor ecosystem. Taking place from May 5-7 at the Malaysia International Trade and Exhibition Centre (MITEC) in Kuala Lumpur, the event offers unparalleled opportunities for networking, knowledge sharing, and business development.

Hanmi Semiconductor's presence at this prestigious event highlights its strategic focus on technological advancement and market growth. By presenting its latest innovations, the company aims to solidify its position as a leader in the semiconductor equipment sector and contribute to the ongoing evolution of chip manufacturing technology.